Current Students
Current students may be contacted in writing at this address:
University of Michigan EECS Bldg, 1301 Beal Avenue, Ann Arbor, Michigan 48109-2122.
Kimberly Beers
Email: [email protected]
Ester Bentley
Bachelor: 2013
Email: [email protected]
Behnoush Rostami
Email: [email protected]
Former PhD Students
 | Sajal Singh Thesis Title: “Fused Silica Precision Shell Integrating (PSI) Navigation-Grade Micro Gyroscopes” Graduation: 05/2020 Employer: Analog Devices |
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Yi Yuan |
 | Donguk (Max) Yang |
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Amin Sandoughsaz |
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Ali Darvishian |
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Tal Nagouney |
 | Yemin (Stacey) Tang Thesis Title: “High Aspect-ratio Biomimetic Hair-like Microstructure Arrays for MEMS Multi-Transducer Platform” Graduation: 12/2017 Employer: |
 | Daniel Egert Thesis Title: “Neural Probes with Deploying Electrodes” Graduation: 04/2015 Employer: University of Michigan Email: [email protected] |
 | Seow Yuen Yee Thesis Title: “Design and Development of an Ultrasonic Jet Array (UJA) for Micro Propulsion” Graduation: 05/2014 Employer: BOSCH |
 | James McCullagh Thesis Title: “Power Conversion Circuits for Low Power, Low Voltage and Non-Periodic Vibration Harvester Outputs” Graduation: 05/2014 Employer: University of Michigan Address: 2001 EECS, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Email: [email protected] |
 | Mahdi Sadeghi Thesis Title: “Electrostatic Micro-Hydraulic Hair Sensors and Actuators” Graduation: 05/2014 Employer: University of Michigan Address: 2001 EECS, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Email: [email protected] |
 | Ali Besharatian Thesis Title: “A Scalable Modular Multistage Peristaltic Electrostatic Gas Micropump” Graduation: 05/2013 Employer: University of Michigan Address: 2411 EECS, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Email: [email protected] |
 | Jeffrey Gregory Thesis Title: “Characterization, Control and Compensation of MEMS Rate and Rate-Integrating Gyroscopes” Graduation: 08/2012 Employer: Analog Devices, Boston, MA |
 | Niloufar Ghafouri Thesis Title: “Bismuth telluride based Co-evaporated Thermoelectric Thin Films: Technology, Characterization, and Optimization” Graduation: 08/2012 Employer: Intel Corp., Arizona |
 | Ethem Erkan Aktakka Thesis Title: “Integration of Bulk Piezoelectric Materials into Microsystems” Graduation: 12/2011 Employer: Post-Doctoral Research Fellow, University of Michigan Address: 2411 EECS, 1301 Beal Avenue, Ann Arbor MI 48105 Email: [email protected] Website: www.eecs.umich.edu/~aktakka |
 | Amir Borna Thesis Title: “A Low-Power, Wireless, Multichannel Microsystem for Reliable Neural Recording” Graduation: 12/2011 Email: [email protected] |
 | Jae Yoong Cho Thesis Title: “Environmentally Resistant Rate- and Rate Integrating Gyroscopes” Graduation: 05/2011 Employer: Post-Doctoral Research Fellow, University of Michigan Address: 2411 EECS, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Email: [email protected] |
 | Andrew Gross Thesis Title: “Low Power, Integrated, Thermoelectric Microcoolers for Microsystems Applications” Graduation: 12/2010 Employer: Sandia National Laboratory |
 | Tzeno Galchev Thesis Title: “Energy Scavenging from Low Frequency Vibrations” Graduation: 12/2010 Employer: Humboldt Research Fellow, University of Freiburg, Germany Email: [email protected] |
 | Sang Won Yoon Thesis Title: “Vibration Isolation and Shock Protection for MEMS” Graduation: 05/2009 Employer: Toyota Technical Center Email: [email protected] |
 | Sang-Hyun Lee Thesis Title: “Wafer-Level Packaging for Environment- Resistant Microinstruments” Graduation: 12/2008 Employer: Samsung LED Co., Ltd. Email: [email protected] Website: https://www.SamsungLED.com |
 | Jay Mitchell Thesis Title: “Low Temperature Wafer Level Vacuum Packaging Using Au-Si Eutectic Bonding and Localized Heating” Graduation: 12/2007 Employer: CEO and Co-Founder, ePack, Inc. Email: [email protected] |
| Warren C. Welch III Thesis Title: “Vacuum and Hermetic Packaging of MEMS Using Solder” Graduation: 12/2007 Employer: RF Micro Devices Email: [email protected] | |
 | Asli Burcu Ucok Thesis Title: “Compact Modular Assembly and Packaging of Multi-substrate Microsystems (WIMS Cube)” Graduation: 03/2006 Employer: Continental-AG Email: [email protected] |
| Hanseup (Steve) Kim Thesis Title: “An Integrated Electrostatic Peristaltic Micropump with Active Microvalves” Graduation: 03/2006 Employer: University of Utah Address: 3280 MEB, 50 S. Central Campus Drive, Salt Lake City UT 84112 Email: [email protected] | |
| Timothy J (TJ) Harpster Thesis Title: “Hermetic Packaging and Bonding Technologies for Implantable Microsystems” Graduation: 10/2005 Employer: Intek Email: [email protected] Website: www.intekflow.com | |
| Stefan A. Nikles Thesis Title: “A Micromachined Sieve Electrode for Chronic Recording From Multiple, Isolated Gustatory Nerve Fibers” Graduation: 08/2005 Employer: MEMSIC, Inc. Email: [email protected] | |
| Pedram Mohseni Thesis Title: “Single-Chip Wireless Microsystems for Multichannel Neural Biopotential Recording” Graduation: 08/2005 Employer: Case Western Reserve University Address: 510 Glennan Building, , Cleveland OH 44106 Email: [email protected] Website: https://vorlon.case.edu/~pedram | |
| Maysam Ghovanloo Thesis Title: “A Wireless Microsystem for Neural Stimulating Microprobes” Graduation: 07/2004 Employer: Arizona State University Address: Engineering Bldg. II (COE II), 2110m Box 7914, Raleigh NC 27695 Email: [email protected] Website: https://www4.ncsu.edu/~mghovan/ | |
| Brian Stark Thesis Title: “Thin Film Technologies for Hermetic and Vacuum Packaging of MEMS” Graduation: 03/2004 Employer: The Bosch Group Email: [email protected] | |
| Chunbo Zhang Thesis Title: “Combustion-Based Micro Power Generation: Thermoelectric and Thermionic Approaches” Graduation: 08/2003 Employer: Honeywell Email: [email protected] | |
| Junseok Chae Thesis Title: “High-Sensitivity, Low-Noise, Multi-Axis Capacitive Micro-Accelerometers” Graduation: 05/2003 Employer: Arizona State University Address: Electrical Engineering, GWC 312, MC: 5506, Tempe AZ 85287-9309 Email: [email protected] | |
| Haluk Kulah Thesis Title: “Closed-Loop Electromechanical Sigma-Delta Microgravity Accelerometers” Graduation: 03/2003 Employer: Middle East Technical University Address: Department of Electrical and Electronics Engineering, DZ-05, Ankara, 06531 Turkey Email: [email protected] Website: https://www.eee.metu.edu.tr/~kulah/ | |
| Tsung-Kuan (Allen) Chou Thesis Title: “All-Silicon Micromachined Acoustic Ejector Arrays for Micro Propulsion and Flow-Contro” Graduation: 10/2001 Employer: Intel Corporation | |
| Arvind Salian Thesis Title: “Design, Fabrication and Testing of High-Performance Capacitive Microaccelerometers” Graduation: 06/2001 Employer: Freescale Semiconductor Email: [email protected] | |
| Babak Amir Parviz Thesis Title: “Development of Ultrasonic Electrostatic Microjets for Distributed Propulsion and Microflight” Graduation: 05/2001 Employer: University of Washington Address: Office M250 EE1, Box 352500, Seattle WA 98195 Email: [email protected] | |
| Y.T. Cheng Thesis Title: “Localized Heating and Bonding Technique for MEMS Packaging” Graduation: 12/2000 Employer: IBM, Watson Research Center Address: P.O. Box 218, Room #36-253, Yorktown Heights NY 10598 Email: [email protected] | |
| Farrokh Ayazi Thesis Title: “A High-Aspect-Ratio Tactical/Inertial Grade Polysilicon Vibrating Ring Gyroscope” Graduation: 01/2000 Employer: Georgia Tech Email: [email protected] Website: https://users.ece.gatech.edu/~ayazi/ | |
| Mehmet Dokmeci Thesis Title: “Hermetic Glass-SiliconMicropackages and Feedthroughs For Neural Prostheses” Graduation: 12/1999 Employer: Northeastern University Address: Electrical & Computer Engineering, 409 DA, 360 Huntington Avenue, Boston MA 02115-5000 Email: [email protected] | |
| Navid Yazdi Thesis Title: “Micro-G Silicon Accelerometers with High Performance CMOS Interface Circuitry” Graduation: 01/1999 Employer: Intellisense Corporation | |
| Chuncieh Huang Thesis Title: “Micromachined Sensors and Actuators for Fluid Mechanics Research and High-Speed Flow Control Applications” Graduation: 09/1998 | |
| Jeffrey A. Von Arx Thesis Title: “A Single Chip, Fully Integrated, Telemetry Powered System for Peripheral Nerve Stimulation” Graduation: 03/1998 Employer: Guidant Corp. Address: Advanced Tech and Res. Eng., 4100 Hamline Avenue North, St. Paul MN 55112 Email: [email protected] Website: www.guidant.com | |
| Arjun Selvakumar Thesis Title: “A Multifunctional Silicon Micromachining Technology for High Performance Microsensors and Microactuators” Graduation: 04/1997 Employer: Colibrys, Inc. Address: Suite 100, 12200 Parc Crest Drive, Stafford TX 77477-2409 Email: [email protected] | |
| Chingwen Yeh Thesis Title: “A Low-Voltage Bulk-Silicon Tunneling-Based Microaccelerometer with CMOS Interface Circuitry” Graduation: 08/1996 | |
| Mark Nardin Thesis Title: “A Programmable Multichannel Microstimulator with Bi-Directional Telemetry” Graduation: 01/1996 | |
| Michael Putty Thesis Title: “A Micromachined Vibrating Ring Gyroscope” Graduation: 03/1995 | |
| Yogesh Gianchandani Thesis Title: “A Bulk Silicon Microelectromechanical System for Scanning Thermal Profilometry” Graduation: 10/1994 Employer: University of Michigan Address: Electrical Engineering, ECE Division, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Email: [email protected] Website: https://www.eecs.umich.edu/~yogesh/ | |
| Tayfun Akin Thesis Title: “An Integrated Telemetric Multichannel Sieve Electrode Array for Nerve Regeneration Applications” Graduation: 10/1994 Employer: Middle East Technical University Address: Electrical & Electronics Engineering Department, , TR-06531 Ankara, Turkey Email: [email protected] Website: https://www.eee.metu.edu.tr/~tayfuna | |
| Karl J. Ma Thesis Title: “An Active Dissolved Wafer Process for The Fabrication of Integrated Sensors” Graduation: 08/1994 | |
| Babak Ziaie Thesis Title: “A Single-Channel Implantable Microstimulator for Functional Neuromuscular Stimulation” Graduation: 03/1994 Employer: Purdue University Address: Electrical & Computer Engineering, BRK 2023, 1205 West State Street, West Lafayette IN 47907-2057 Email: [email protected] | |
Former Masters Students | |
| Anthony Coghlan Thesis Title: “A High-Efficiency Class-E Transmitter For Implantable Devices” Graduation: 05/1997 Position: Director, Single Family CFO Strategy, Planning and Development, Finance Division, Freddie Mac Address: Freddie Mac, 8200 Jones Branch Drive, MS 486, McLean VA 22102 Email: [email protected] | |
| Namik Kocaman Thesis Title: “A Low-Power capacitive Interface and Analog-Digital Converter Chip For Implantable Biotelemetry” Graduation: 08/1997 Position: Engineering Manager, Analog & Mixed Signal Circuit Design Address: Broadcom Corporation, 5300 California Avenue, Irvine CA 92617 Email: [email protected] | |
| Rajagopalan Rangarajan Thesis Title: “Fully Integrated Nerve Electrical Stimulation System” Graduation: 01/1997 | |
| Sha Wang Thesis Title: “FEM Analysis and Its Application in the Electronic Determination of the Young’s Modulus and Intrinsic Stress” Graduation: 05/1992 | |
Current Researchers and Visitors | |
 | Jae Yoong Cho Position: Assistant Research Scientist, University of Michigan Address: 2227 EECS, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Phone: 734-647-3984 Email: [email protected] |
 | Guohong He Position: Assistant Research Scientist, University of Michigan Address: 2229 EECS, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Phone: 734-647-5363 Email: [email protected] |
 | Jong-Kwan Woo Position: Senior Research Fellow, University of Michigan Address: 2407 EECS, 1301 Beal Avenue, Ann Arbor MI 48109-2122 Phone: 734-764-5160 Email: [email protected] |
Former Researchers and Visitors | |
| Ethem Erkan Akttaka Position: Assistant Research Scientist Email: [email protected] |
| Daniel Egert Position: Research Fellow, University of Michigan Email: [email protected] |
 | Sangwoo Lee Position: Visiting Assistant Research Scientist, University of Michigan Email: [email protected] |
 | Adrian Zurbuchen Position: Post Doc, University of Michigan Email: [email protected] |